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SOIC Series Selected Sub-test Taping Machine
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The SOIC series selected sub-test taping machine is used for appearance inspection, character detection, sorting, packaging, etc. of integrated circuit chips.  It is applied in the field of semiconductor BE(BACK-END) packaging and testing, effectively ensuring the quality and efficiency of integrated circuit chip products and production.


Model : HX002-SOIC

Size : 1200*1000*1800

Production efficiency : ≥35000pcs/H


It can adapt to products with different pin numbers in the same series of SOIC, and different series products only need to replace the guided mode.


Performance indicators
  • UPH: 35000pcs/h (The test duration is 40ms)

  • Run UPH empty: 45k~48k

  • MTBA>120min

  • MTBF>168H

  • Test failure rate<3‰

  • Staffing 3~5 units/person

  • Weight:1200 kg

Special functions
  • Torque control: visual monitor of the motor's downward press torque, providing real-time feedback. The torque during the downward movement of the equipment is within the set range; And it has automatic calibration based on torque values.

  • Quick changeover: in order to adapt to the full series of SOT23 products, our products adopts a universal design concept to the best of our ability, and even for those products with significant differences, only satellite discs and other parts need to be changed.

Software functions
  • Motion control is developed based on upper computer

  • The device supports GPIB/TTL/RS232 communication

  • The equipment has SECSGEM communication function

  • The motor of the test station has the function of automatic height calibration and can issue the pressure detection report.

  • HARDWARE CHECK function is available.

  • vision devices can support GR&R (dynamic and static correction).

  • Operation permission level control.

Module systems
  • Feeding system

  • Direction judgment system

  • Positioning and correction system

  • Image detection system

  • Laser system (optional)

  • Braiding system

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