High-Speed SMT Pick and Place Machine

Product introductions

Performance indicators

UPH (Units per Hour): 10,000 ~ 12,000 PCS/H
Yield: >99.9%
Placement Accuracy: 5 µm ~ 10 µm
Angle Accuracy: ±0.5°
Operating Environment: 24°C ± 2°C, 45% ~ 75% RH
Machine Dimensions: L2400mm * D1400mm * H1400mm (excluding indicator lights)
Die Size: 0.25mm x 0.25mm to 15mm x 15mm (custom sizes available)
Dispensing Shapes: Programmable: Dot, Line, Cross, X, Grid

Special functions

Selectable Pre-bond or Post-bond；
Pre-bond / Post-bond Detection: Provides options for pre-bond and post-bond inspection；
Wafer Chip Inspection Function: Automatic identification of ink dots and defects；
Real-time Adjustment of Bonding Position and Angle；
Wafer Mapping Function；
Track Memory / Rework Function；
Supports Factory Vacuum；
Open SECS/GEM Port: Supports future networking capabilities via SECS/GEM protocol；
Deionized Air System (Optional)；
Power Failure Protection；
Anti-static Keyboard and Mouse；
Real-time Automatic Quality Correction

Software functions

High-Precision Alignment System: Utilizes advanced image processing algorithms to support high-precision component alignment, ensuring placement accuracy meets the stringent requirements of semiconductor manufacturing.
Intelligent Component Recognition: Integrates a machine vision system capable of automatically recognizing and classifying different types of components, including irregular and small components, enhancing placement flexibility.
Multi-level Program Optimization: Supports multi-level placement program optimization, automatically adjusting placement sequence and parameters according to different product and process requirements.
Dynamic Placement Speed Adjustment: Dynamically adjusts placement speed based on actual production conditions and component types to improve overall production efficiency.
Real-time Monitoring and Feedback: Continuously monitors the equipment status and key parameters during the placement process, providing timely feedback and adjustments to ensure process stability.
Self-Learning and Adaptive Algorithms: The system uses machine learning technology to learn from historical production data, optimizing placement processes and strategies.
Data Integration and Traceability: Supports integration with other systems, such as MES (Manufacturing Execution Systems), ensuring the completeness and traceability of production data.
Customizable User Interface: Offers a flexible user interface design, allowing operators to customize the display content and operation flow based on their needs.
Remote Diagnostics and Maintenance: Supports remote monitoring and fault diagnosis, reducing equipment downtime and improving maintenance efficiency.

Module systems

Vision Alignment System
Dispensing System
Substrate Conveying System
Wafer Conveying System
Wafer Pick-up System
Flip Chip System
Pick and Place System

Return list

Previous post：Fully Automatic Gold Wire Detection Machine Next chapter：Blue Film Feeding Rotary Tower Taping Sorting Machine

Product

UPH (Units per Hour): 10,000 ~ 12,000 PCS/H

Yield: >99.9%

Placement Accuracy: 5 µm ~ 10 µm

Angle Accuracy: ±0.5°

Operating Environment: 24°C ± 2°C, 45% ~ 75% RH

Machine Dimensions: L2400mm * D1400mm * H1400mm (excluding indicator lights)

Die Size: 0.25mm x 0.25mm to 15mm x 15mm (custom sizes available)

Dispensing Shapes: Programmable: Dot, Line, Cross, X, Grid

Selectable Pre-bond or Post-bond；

Pre-bond / Post-bond Detection: Provides options for pre-bond and post-bond inspection；

Wafer Chip Inspection Function: Automatic identification of ink dots and defects；

Real-time Adjustment of Bonding Position and Angle；

Wafer Mapping Function；

Track Memory / Rework Function；

Supports Factory Vacuum；

Open SECS/GEM Port: Supports future networking capabilities via SECS/GEM protocol；

Deionized Air System (Optional)；

Power Failure Protection；

Anti-static Keyboard and Mouse；

Real-time Automatic Quality Correction

High-Precision Alignment System: Utilizes advanced image processing algorithms to support high-precision component alignment, ensuring placement accuracy meets the stringent requirements of semiconductor manufacturing.

Intelligent Component Recognition: Integrates a machine vision system capable of automatically recognizing and classifying different types of components, including irregular and small components, enhancing placement flexibility.

Multi-level Program Optimization: Supports multi-level placement program optimization, automatically adjusting placement sequence and parameters according to different product and process requirements.

Dynamic Placement Speed Adjustment: Dynamically adjusts placement speed based on actual production conditions and component types to improve overall production efficiency.

Real-time Monitoring and Feedback: Continuously monitors the equipment status and key parameters during the placement process, providing timely feedback and adjustments to ensure process stability.

Self-Learning and Adaptive Algorithms: The system uses machine learning technology to learn from historical production data, optimizing placement processes and strategies.

Data Integration and Traceability: Supports integration with other systems, such as MES (Manufacturing Execution Systems), ensuring the completeness and traceability of production data.

Customizable User Interface: Offers a flexible user interface design, allowing operators to customize the display content and operation flow based on their needs.

Remote Diagnostics and Maintenance: Supports remote monitoring and fault diagnosis, reducing equipment downtime and improving maintenance efficiency.

Vision Alignment System

Dispensing System

Substrate Conveying System

Wafer Conveying System

Wafer Pick-up System

Flip Chip System

Pick and Place System

0512-57754958