Blue Film Feeding Rotary Tower Taping Sorting Machine

Product introductions

This equipment is used for wafer-level advanced packaging chip performance and appearance inspection, as well as tape and reel packaging.

Function:The machine is equipped with standard wafer feeding, Tape & Reel output, and supports expansion options for various feeding methods such as Bowl Feeder, Tray, Tape, Tube, and multiple output options like Tray, Tube, Bulk, and Dual Tape.

Application Field:Utilizing a patented vision inspection system, it inspects chip dimensions, appearance defects, marks, OCR, and more. It is suitable for strip CSP, WLCSP, bare chips, and other forms of packaging.

Performance indicators

Product Types: Strip CSP, Wafer-Level CSP, Bare Chips, Plastic Products
Feeding Method: Wafer Feeding
Output Method: Tape & Reel or Tray
Wafer Size: 6-inch / 12-inch
Product Size: 0.2mm * 0.4mm to 7mm * 7mm
UPH (Units Per Hour): Up to 30K (maximum)
Carrier Tape Width: 8mm ~ 16mm
Inspection Stations:Front-side inspection\ Back-side inspection\ Electrical performance inspection\ Internal tape inspection\ 5S inspection (optional)\ Post-taping inspection (optional)\ 3D Bump Inspection\ Coplanarity\ Pin marks\ Pad quality
Inspection Items: Product dimensions\ Surface scratches\ foreign objects\ missing corners\ cutting quality\ markings\ orientation\ indentation quality\ indentation offset
OCR Inspection: Available
2D Matrix: Available
Optional Features:OS testing\ Dual tape\ Rework tape to tape\ Rework to blue film
MTBA (Mean Time Between Adjustments): 1 hour
MTBF (Mean Time Between Failures): 1,000 hours
Machine Dimensions: 2600mm * 1600mm * 2200mm

Special functions

High Efficiency: The rotary tower design enables rapid cycling, with efficient feeding and taping processes that reduce downtime on the production line.
Precise Sorting: Equipped with high-precision sensors and an image recognition system, the machine can accurately identify and sort semiconductor components of various specifications and models.
lue Film Protection: Blue film feeding effectively protects sensitive components, preventing static discharge and contamination, ensuring product quality.
Multifunctional Compatibility: The system can accommodate various types of components and supports different specifications of carrier tape, offering great flexibility.
Intelligent Control: Featuring a PLC control system, the machine supports real-time monitoring and data recording, making it easier for operation management and maintenance.
User-Friendly Design: The user interface is intuitive, making training and operation easy. It also includes a self-diagnosis function to reduce operational risks.
Compact Structure: With a small footprint, the machine is suitable for high-density production environments and optimizes the layout of production lines.

Software functions

Software Features: Supports both Mapping and Non-Mapping modes;
Mapping mode supports value modification and traceability functions;
Nozzle height calibration;
Automatic nozzle compensation;
Supports SECS/GEM communication protocol.

Module systems

Module System:
Non-contact positioning module
Sorting module
Taping module
Inverted main rotary tower module
Flip module
Wafer module

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Product

Product Types: Strip CSP, Wafer-Level CSP, Bare Chips, Plastic Products

Feeding Method: Wafer Feeding

Output Method: Tape & Reel or Tray

Wafer Size: 6-inch / 12-inch

Product Size: 0.2mm * 0.4mm to 7mm * 7mm

UPH (Units Per Hour): Up to 30K (maximum)

Carrier Tape Width: 8mm ~ 16mm

Inspection Stations:Front-side inspection\ Back-side inspection\ Electrical performance inspection\ Internal tape inspection\ 5S inspection (optional)\ Post-taping inspection (optional)\ 3D Bump Inspection\ Coplanarity\ Pin marks\ Pad quality

Inspection Items: Product dimensions\ Surface scratches\ foreign objects\ missing corners\ cutting quality\ markings\ orientation\ indentation quality\ indentation offset

OCR Inspection: Available

2D Matrix: Available

Optional Features:OS testing\ Dual tape\ Rework tape to tape\ Rework to blue film

MTBA (Mean Time Between Adjustments): 1 hour

MTBF (Mean Time Between Failures): 1,000 hours

Machine Dimensions: 2600mm * 1600mm * 2200mm

High Efficiency: The rotary tower design enables rapid cycling, with efficient feeding and taping processes that reduce downtime on the production line.

Precise Sorting: Equipped with high-precision sensors and an image recognition system, the machine can accurately identify and sort semiconductor components of various specifications and models.

lue Film Protection: Blue film feeding effectively protects sensitive components, preventing static discharge and contamination, ensuring product quality.

Multifunctional Compatibility: The system can accommodate various types of components and supports different specifications of carrier tape, offering great flexibility.

Intelligent Control: Featuring a PLC control system, the machine supports real-time monitoring and data recording, making it easier for operation management and maintenance.

User-Friendly Design: The user interface is intuitive, making training and operation easy. It also includes a self-diagnosis function to reduce operational risks.

Compact Structure: With a small footprint, the machine is suitable for high-density production environments and optimizes the layout of production lines.

Software Features: Supports both Mapping and Non-Mapping modes;

Mapping mode supports value modification and traceability functions;

Nozzle height calibration;

Automatic nozzle compensation;

Supports SECS/GEM communication protocol.

Module System:

Non-contact positioning module

Sorting module

Taping module

Inverted main rotary tower module

Flip module

Wafer module

0512-57754958