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IC Pick and Place Machine
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The transfer machine is used to take designated dice from the blue tape to tray and automatically lay them out. To be more specific, the wafer transfer machine is to achieve automatic delivering and placement of chips from blue tape to tray, product basket feeding and automatic switching of tray. 

8 inch/12 inch wafer 

model: HXYZ-0001 

Size: 1370 * 1150 * 1800 

Production efficiency: ≥ 6500pcs

Performance indicators
  • Moving load UPH: 6500pcs/h

  • Swing arm UPH:10000pcs/h

  • MTBA>30min

  • Utilization rate>85%

  • Staffing 3~5 units/person

  • weight:800 kg

Special functions
  • Transfer type: Use the XY platform module to pull in the steel dic by the motor, move to the specified position based on positioning, then swing arm module grabs the product through the pik-up head.

  • Swing arm type: Mainly used for the delivery of small-sized devices. For the fact that the up and down movement range of the swing arm is ≤ 2mm, it is suitable only for small devices, while the speed is significantly improved compared to the transfer type.

Software functions
  • The swing arm type is only suitable for devices with dimensions below 4 * 4mm.

  • Fast response of the software and precise positioning

  • Windows 10, independently developed software

  • Operation limits control according to the rank of the operator.

Module systems
  • Basket loading system

  • Swing arm module system

  • XY module system

  • Material receiving system

  • Image detection system

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