Wafer Transfer Machine - Product - Suzhou Huansun Semitech Co,.ltd

Wafer Transfer Machine

Product introductions

The transfer machine is used to take designated dice from the blue tape to tray and automatically lay them out. To be more specific, the wafer transfer machine is to achieve automatic delivering and placement of chips from blue tape to tray, product basket feeding and automatic switching of tray.

8 inch/12 inch wafer

model: HXYZ-0001

Size: 1370 * 1150 * 1800

Production efficiency: ≥ 6500pcs

Performance indicators

Moving load UPH: 6500pcs/h
Swing arm UPH：10000pcs/h
MTBA>30min
Utilization rate>85%
Staffing 3~5 units/person
weight：800 kg

Special functions

Transfer type: Use the XY platform module to pull in the steel dic by the motor, move to the specified position based on positioning, then swing arm module grabs the product through the pik-up head.
Swing arm type: Mainly used for the delivery of small-sized devices. For the fact that the up and down movement range of the swing arm is ≤ 2mm, it is suitable only for small devices, while the speed is significantly improved compared to the transfer type.

Software functions

The swing arm type is only suitable for devices with dimensions below 4 * 4mm.
Fast response of the software and precise positioning
Windows 10, independently developed software
Operation limits control according to the rank of the operator.

Module systems

Basket loading system
Swing arm module system
XY module system
Material receiving system
Image detection system

Return list

Previous post：SOIC Series Selected Sub-test Taping Machine Next chapter：Six-sided Appearance Inspection Machine

Product

Moving load UPH: 6500pcs/h

Swing arm UPH：10000pcs/h

MTBA>30min

Utilization rate>85%

Staffing 3~5 units/person

weight：800 kg

Transfer type: Use the XY platform module to pull in the steel dic by the motor, move to the specified position based on positioning, then swing arm module grabs the product through the pik-up head.

Swing arm type: Mainly used for the delivery of small-sized devices. For the fact that the up and down movement range of the swing arm is ≤ 2mm, it is suitable only for small devices, while the speed is significantly improved compared to the transfer type.

The swing arm type is only suitable for devices with dimensions below 4 * 4mm.

Fast response of the software and precise positioning

Windows 10, independently developed software

Operation limits control according to the rank of the operator.

Basket loading system

Swing arm module system

XY module system

Material receiving system

Image detection system

0512-57754958