Six-sided Appearance Inspection Machine

Product introductions

Six-sided appearance inspection machine is designed to detect IC chips' appearance defects. Six surfaces of the device are analyzed by industrial CCD camera through a turret-like motion, and the device classification is determined by the judgment results of the acquired images.The crystal oscillator series six-sided appearance inspection machine can adapt to the entire series of products in the quartz crystal oscillator industry, and is used to inspect the appearance defects as well as complex defects of each side of the device.

Model：HXWG-2520

Size：1200*1030*1800

UPH:≥8000pcs/H

Performance indicators

UPH: 8000pcs/h
Run UPH empty: 25k~30k
MTBA>120min
MTBF>168H
Detection of missed detection rate＜0.4%
Staffing 3~5 units/person
Weight：700-800 kg
占地面积：1200mm*1030mm

Special functions

Hidden crack detection: it has distinctive hidden crack detection function. Unlike conventional defect detection, hidden crack detection has higher requirements for the light sources and the learning ability of the visual system.
Multi directional exposure technology: in order to detect difficult defect types, a technology has been developed to quickly and sequentially expose and take photos in multiple directions, and finally synthesize images from various directions for analysis.

Software functions

The device operates based on PC command.
The device supports GPIB/TTL/RS232 communication.
The device has SECSGEM communication function.
Images are capable of deep learning , which improves accuracy through continuous learning and upgrading during the generation process.
The pick-up head is equipped with automatic height calibration function.
Operation limits control according to the rank of the operator.

Module systems

Charging system
Position and deviation rectification system
Side detection system
Front detection system
Bottom detection system
Sorting system

Return list

Previous post：Wafer Transfer Machine Next chapter：High Speed Visual Intelligent Sorting Equipment

Product

UPH: 8000pcs/h

Run UPH empty: 25k~30k

MTBA>120min

MTBF>168H

Detection of missed detection rate＜0.4%

Staffing 3~5 units/person

Weight：700-800 kg

占地面积：1200mm*1030mm

Hidden crack detection: it has distinctive hidden crack detection function. Unlike conventional defect detection, hidden crack detection has higher requirements for the light sources and the learning ability of the visual system.

Multi directional exposure technology: in order to detect difficult defect types, a technology has been developed to quickly and sequentially expose and take photos in multiple directions, and finally synthesize images from various directions for analysis.

The device operates based on PC command.

The device supports GPIB/TTL/RS232 communication.

The device has SECSGEM communication function.

Images are capable of deep learning , which improves accuracy through continuous learning and upgrading during the generation process.

The pick-up head is equipped with automatic height calibration function.

Operation limits control according to the rank of the operator.

Charging system

Position and deviation rectification system

Side detection system

Front detection system

Bottom detection system

Sorting system

0512-57754958