Through strenuous efforts, Huansun launched the turret type selected sub-test taping machine on January 31, 2023, which is used for appearance inspection, character detection, sorting, packaging, etc. of integrated circuit chips. It is applied in the field of semiconductor post packaging testing, effectively ensuring the quality of integrated circuit chip products and improving the production efficiency of integrated circuit chips. In terms of traditional performance, Huansun has fit in the top level in China, our company also has the following key technologies that are not yet available in China: 1. Automatically calibrating the suction nozzle height through motor torque; 2. SECSGEM communication function.

Suitable packaging form: CSP/DFN/QFN; UPH (test for 30ms) ≥ 30000/H; Material loss rate ≤ 0.01%; MTBA>1h;  AHC/FCF/MRA/ABR equipped; Module replacement adjustment time<4h